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    With long-term experience, Weijiaxin Electronics has a variety of methods to deal with all kinds of packages, and can provide the best way to open the film (Decap), remove the glue (Removal, Compound Removal), let you follow The experiment did not go bad. The following are some of the items, please contact us for a detailed discussion.

    Package Open Cover (Decap)

    LED, gallium arsenide chip, automotive chip, optical coupling chip

    Special Cover (Decap)

    Backside, MEMS, packaging materials, various package disassembly

    chemical etching analysis

    Crater test, de-soldering oil/stain, chemical etching to photoresist, Pin foot cleaning

    case sharing

    

        Due to the variety of package types, there are various package forms to handle the execution experience.